2023-10-30
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17:50:39
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2023-10-30 14:56:17 Posting Spiegel@予備系 spiegel@fedibird.com
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17:48:11
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2023-10-30 12:07:58 Posting 藤井太洋, Taiyo Fujii taiyo@ostatus.taiyolab.com
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17:46:49
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2023-10-30 10:17:06 Posting HON.jp News Blog honjp@mastodon-japan.net
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Threads、外部サービス連携APIを提供へ。Instagram責任者モセリ氏が発言║テクノエッジ TechnoEdge
techno-edge.net/article/2023/1

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https://www.techno-edge.net/article/2023/10/29/2157.html
Threads、外部サービス連携APIを提供へ。Instagram責任者モセリ氏が発言 | テクノエッジ TechnoEdge
17:46:33
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2023-10-30 09:32:34 Posting Spiegel@予備系 spiegel@fedibird.com
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17:46:07
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2023-10-30 08:20:32 Posting 三春充希(はる)⭐未来社会プロジェクト miraisyakai@mstdn.jp
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17:45:53
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2023-10-30 08:09:41 Posting Spiegel@予備系 spiegel@fedibird.com
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17:45:14
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2023-10-29 17:20:58 Posting Blippy the Wonder Slug 🇩🇪🇨🇦🇺🇸 BlippyTheWonderSlug@social.cologne
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17:44:51
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2023-10-29 22:03:03 Posting 藤井太洋, Taiyo Fujii taiyo@ostatus.taiyolab.com
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17:44:44
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2023-10-29 21:55:11 Posting MobileFF mobileff@fedibird.com
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17:44:24
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2023-10-29 20:55:40 Posting たけうちひろあき :zonepane: takke@fedibird.com
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10:48:54
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パッケージングなら日本の出番、と思いきや… "高性能GPUには、TSMCの「CoWoS」と呼ばれる高度な独自パッケージング技術が必要になる" (´･ω･`) // NVIDIAのGPU不足「ボトルネックはパッケージング」：日本経済新聞
nikkei.com/article/DGXZQOUC196

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https://www.nikkei.com/article/DGXZQOUC196UD0Z11C23A0000000/
NVIDIAのGPU不足「ボトルネックはパッケージング」 - 日本経済新聞
2023-10-30